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Congratulations to the 2013 winners!
Process Control Tools: Microscan (Mini Hawk Xi)
Screen/Stencil Printing: Speedprint (SP710avi with Advanced Dispense Unit)
Screen/Stencil Printing Peripherals: Count On Tools (ezLOAD PCB Support System for Screen Printers)
Cleaning Equipment: Austin American Technology (NanoJet Aqueous Inline Cleaning System)
Device Programming: BPM Microsystems (2800ISP Semi-Automated In-System Device Programmer)
Dispensing Equipment: Nordson Asymtek (NexJet System)
Test & Inspection – AOI: Mirtec Corp. (MV-9 2D/3D In-Line AOI Series)
Test & Inspection – ICT: Acculogic (Ultimate Accuracy Package for Flying Scorpion)
Test & Inspection – Functional Test: Multitest Elektronische Systeme (InStrip 3D)
Test & Inspection – AXI: VJ Electronix (Vertex II X-Ray Inspection System)
Test & Inspection – SPI: Parmi (SPI HS70)
Soldering Materials: Nihon Superior (SN100C P604 D4 Solder Paste)
Automation Tools: Count On Tools (Stripfeeder .mod Series)0
Component Placement – Multifunction: Universal Instruments (FuzionXC2-37 Platform)
Soldering – Reflow: Rehm Thermal Systems (Vision XP 934 Quad Lane Convection Reflow Oven)
Soldering – Selective: ACE Production Technologies (ACE KISS-205 Selective Soldering with In-Line Concurrent Processing)
Cleaning Materials: Kyzen (Aquanox A4639 Electronic Assembly Aqueous Solution)
Labeling Equipment: Cogiscan (Murata Magicstrap for PCB RFID Tracking Integrated with Cogiscan TTC Middleware)
Software – Process Control: Viscom (SPI-AOI Uplink)
Soldering – Other: EVS International (EVS 10K Solder Recovery Machine)
Coatings/Encapsulants: FCT Assembly (NanoCoat Multilayer System)
Rework & Repair Tools: Air Vac Engineering (PCBRM100)
Flux: AIM (NC277 Liquid Flux)
First Article Inspection: CGI Americas (Newly n=1 First Article Inspection System)
Past Winners
2012
Process Control Tools: Cognex (DataMan 500)
Screen/Stencil Printing Equipment: Speedprint (Speedprint SP700avi)
Screen/Stencil Printing Peripherals: Seika Machinery (Sawa Ultrasonic Stencil Cleaner SC-AH100F-LV Low-VOC Model)
Cleaning Equipment: Aqueous Technologies (Trident XLD)
Device Programming: Data I/O Corp. (RoadRunner 3 with FIS)
Dispensing Equipment: GPD Global (PCD Dispensing on MAX Series Platform)
Test & Inspection – AOI: CyberOptics Corp. (QX100)
Test & Inspection – ICT: Datest (SPEA 4060 Flying Probe Tester with Goepel Boundary Scan)
Test & Inspection – Functional Test: Agilent Technologies (Agilent TS-8900)
Test & Inspection – AXI: ViTrox Technologies (V810 In-Line 3D AXI)
Soldering Materials: AIM (NC259 Solder Paste)
Automation Tools: LPKF Laser & Electronics (LPKF MicroLine 1120 P)
Component Placement – Multifunction: Assembléon America (iFlex)
Component Placement – High-Speed: Juki Corp. (Sentry)
Soldering – Reflow: Speedline Technologies (Closed Loop Nitrogen Control)
Soldering – Selective: SEHO Systems (AOI System to be embedded in Selective Soldering Machine)
Cleaning Materials: Kyzen Corp. (Aquanox A4638)
Labeling Equipment: Cogiscan (LabelScan Automated Vision System)
Software – Production: Juki Corp. (Juki IS NPI+ Bundle)
Software – Process Control: Microscan (AutoVISION Machine Vision Software)
Soldering – Other: EVS (EVS 7000LFHS Solder Recovery System Redesign)
Cored Wire: Nihon Superior (SN100C (551CT) Lead-Free Flux-Cored Solder Wire)
Coatings/Encapsulants: Semblant Inc. (SPF (Semblant Plasma Finish))
Rework & Repair Tools: Christopher Associates (Magnus HD Trend)
Soldering – Wave: KIC (KIC 24/7 Wave)
Surface Treatment: Dow Electronic Materials (Circuposit Hole Prep 4126 Sweller)
2011
Process Control Tools: KIC (MVP – Manual Virtual Profiling Fixture)
Screen/Stencil Printing Equipment: Milara (TD2929)
Screen/Stencil Printing Peripherals: DEK (Nano-ProTek)
Cleaning Equipment: Aqueous Technologies (Trident Zero)
Device Programming: BPM Microsystems (2800 Concurrent Programming System)
Dispensing Equipment: GPD Global (PCD Dispensing)
Test and Inspection – AOI: CyberOptics (QX500 AOI System)
Test and Inspection – ICT: Datest (SPEA 4060 Flying Probe Tester)
Soldering Materials: FCT Assembly (NL930PT Pin Probable Solder Paste)
Automation Tools: Count On Tools (LED Nozzle Series)
Component Placement – Multifunction: Essemtec (Cobra SMT Pick-and-Place)
Component Placement – High-Speed: Universal Instruments (Advantis 3 Platform)
Soldering – Reflow: BTU (Pyramax with Dual Lane Dual Speed Capability)
Soldering – Selective: Juki (FlexSolderWave FSW620-EF)
Cleaning Materials: Kyzen Corp. (Aquanox A4705)
Labeling Equipment: ASYS Group Americas (Insignum 2000)
Software Production: ASYS Group Americas (Simplex: Natural User Interface)
Bonders: Palomar Technologies (3800 Die Bonder)
Software/Process Control: Speedline Technologies (SPI Print Optimizer)
Soldering – Other: EVS International (EVS 7000LFHS)
Cored Wire: Nihon Superior (SN100C (044) Solder Wire)
Coatings/Encapsulants: Henkel Electronic Materials (Macromelt OM341)
Rework & Repair Tools: VJ Electronix (SRT Micra)
Software – Management: Mentor Graphics (Valor vManage Materials Manager)
Flux: Nihon Superior (NS-F900)
Test and Inspection – AXI: Christopher Associates (Akila XR-3 PCB Inspection System)
Final Finish: Dow Electronic Materials (Aurolectroless SMT-520)
System Modeling and Simulation Tools: National Instruments (NI Multisim 11.0.1)
Design Verification Tools: National Instruments (NI Multisim Component Evaluator)
PCB Design Tools: Allied Electronics (DesignSpark PCB)
Laminates: Rogers (RT/duroid 6035HTC)
Registration and Tooling: XACTPCB Ltd. (XACT X-section)
2010
Automation Tools: Production Solutions Inc. (RED-E-SET Ultra HD)
Cleaning Equipment: Aqueous (Trident Quad)
Cleaning Materials: Kyzen Corp. (Aquanox A4703)
Component Placement-High-Speed: Assembléon (MC-24X)
Component Placement-Multi-Function: Europlacer (XPii-II SMT Assembler)
Device Programming: Data I/O (FlashCORE III)
Labeling Equipment: Polyonics (XF-781 Thermal Transfer Printable Polyimide)
Materials-Flux: FCT Assembly (NC160 Flux)
Process Control Tools: KIC (e-Clipse Thermocouple Attachment)
Rework/Repair Tools: R&D Technical Services (Vaporworks 24 Rev 2)
Screen/Stencil Printing: DEK International (VectorGuard Platinum Dual Layer Stencil)
Software-Production: Panasonic Factory Solutions Co of America (PanaCIM Enterprise Edition)
Software-Process Control: Microscan (TTC Solution)
Software-Management: Valor (MSS)
Soldering-Materials: Cobar Solder Products (Aquasol)
Soldering-Reflow: Speedline Technologies (OmniMax Reflow Soldering System)
Soldering-Selective: Juki Corp. (Inline Flex Solder W510)
Soldering-Wave: SEHO Systems (SEHO Real-Time Fluxer Control)
Soldering-Other: EVS International (EVS 9000 Solder Dross Recovery Solution)
Test & Inspection-ICT: Acculogic Inc. (FLS980Dxi Flying Scorpion)
Test & Inspection-AOI: Koh Young (Zenith 3D AOI System)
Adhesives: Henkel Corporation (Hysol Eccobond CA3556HF)
Laminates: Rogers Corporation (RO4360 Thermoset)
Imaging: WKK Distribution Ltd. (X-Pose SM120 Exposure System)
System Modeling and Simulation Tools: National Instruments (NI Multisim 11.0 Circuit Simulation & Analysis Software)
PCB Design Tools: Sunstone Circuits (PCB123)2009
2009
Automation Tools: ASYS (FIFO Buffer System FPS30B)
Cleaning Equipment: Speedline Technologies (Electrovert’s Aquastorm 100)
Cleaning Materials: Kyzen Corporation (Aquanox A4241)
Component Placement - High-Speed: Juki Corp. (FX3)
Component Placement - Multi-Function: Juki Corp. (JX100)
Device Programming: BPM Microsystems (Flashstream –C)
Dispensing Equipment: Asymtek (DispenseJet DJ-100)
Labeling: Polyonics (Product Sentry)
Materials-Flux: Nihon Superior (NS-F850)
Process Control Tools: KIC (RPI)
Rework/Repair Tools: VJ Electronix (400ST)
Screen/Stencil Printing: Milara (TD2929 Automatic Inline Printer)
Screen/Stencil Printing: Assembléon (Yamaha YGP)
Software-Production: Juki Corp. (Intelligent Shopfloor Solutions)
Soldering-Materials: Henkel Corporation (Multicore LF700)
Soldering-Reflow: Heller Industries (Mark 3.5 Series)
Soldering-Selective: Juki Corp. (Flex Solder Series)
Soldering-Other: EVS International (EVS 7000 Solder Dross Recovery)
Test & Inspection-AXI: Dage Precision Industries (Dage XD7600NT100)
Test & Inspection-ICT: Agilent Technologies (Cover Extend)
Test & Inspection-AOI: Mirtec Corp. (Mirtec MV-3L)
Underfills: Henkel Corporation (Hysol UF3800)
Soldering-Hand Tools: OK International (Metcal MX-5000 Series)
2008
Automation Tools: Inovaxe (InoCart-MSD)
Cleaning Equipment: Aqueous Technologies (Trident)
Cleaning Materials: Kyzen (Aquanox A4625B)
Component Placement–High-Speed: Siemens (SIPLACE X4i)
Component Placement–Multi-Function: Europlacer (iineo)
Device Programming: BPM Microsystems (Flashstream)
Dispensing Equipment: Ovation Products (Stinger)
Labeling: Polyonics (Polyimide Label Stock)
Materials-Flux: Nihon Superior (NS-F850)
Process Control Tools: ECD (Megam.o.l.e. 20 Thermal Profiler)
Rework/Repair: R&D Technical Services (Vapor Works 24)
Screen/Stencil Printing: ICON Technologies (ICON i8)
Software-Management: Optimal (Optel)
Software-Process Control: DEK (Instinctiv V9)
Software-Production: Juki (OPASS)
Soldering-Materials: Nihon Superior/Balver-Zinn/DKL/FCT (SN100C)
Soldering-Reflow: Speedline Technologies (Electrovert IFC)
Soldering-Selective: Juki (Juki 350)
Soldering-Other: EVS International (EVS 1000 Solder Recovery System)
Test & Inspection–AXI: VJ Electronix (Vertex Series "A")
Test & Inspection–ICT: Everett Charles Technologies (Gemini Spring Pin)
Test & Inspection–AOI: Mirtec (MV-7L)
Underfills: Henkel (Loctite 3508)
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