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Congratulations to the 2011 winners!

Process Control Tools: KIC (MVP – Manual Virtual Profiling Fixture)
Screen/Stencil Printing Equipment: Milara (TD2929)
Screen/Stencil Printing Peripherals: DEK (Nano-ProTek)
Cleaning Equipment: Aqueous Technologies (Trident Zero) 
Device Programming: BPM Microsystems (2800 Concurrent Programming System) 
Dispensing Equipment: GPD Global (PCD Dispensing)
Test and Inspection – AOI: CyberOptics (QX500 AOI System)
Test and Inspection – ICT: Datest (SPEA 4060 Flying Probe Tester)
Soldering Materials: FCT Assembly (NL930PT Pin Probable Solder Paste)
Automation Tools: Count On Tools (LED Nozzle Series)
Component Placement – Multifunction: Essemtec (Cobra SMT Pick-and-Place)
Component Placement – High-Speed: Universal Instruments (Advantis 3 Platform)
Soldering – Reflow: BTU (Pyramax with Dual Lane Dual Speed Capability)
Soldering – Selective: Juki (FlexSolderWave FSW620-EF)
Cleaning Materials: Kyzen Corp. (Aquanox A4705)
Labeling Equipment: ASYS Group Americas (Insignum 2000)
Software Production: ASYS Group Americas (Simplex: Natural User Interface)
Bonders: Palomar Technologies (3800 Die Bonder)
Software/Process Control: Speedline Technologies (SPI Print Optimizer)
Soldering – Other: EVS International (EVS 7000LFHS)
Cored Wire: Nihon Superior (SN100C (044) Solder Wire)
Coatings/Encapsulants: Henkel Electronic Materials (Macromelt OM341)
Rework & Repair Tools: VJ Electronix (SRT Micra)
Software – Management: Mentor Graphics (Valor vManage Materials Manager)
Flux: Nihon Superior (NS-F900)
Test and Inspection – AXI: Christopher Associates (Akila XR-3 PCB Inspection System)
Final Finish: Dow Electronic Materials (Aurolectroless SMT-520)
System Modeling and Simulation Tools: National Instruments (NI Multisim 11.0.1)
Design Verification Tools: National Instruments (NI Multisim Component Evaluator)
PCB Design Tools: Allied Electronics (DesignSpark PCB)
Laminates: Rogers (RT/duroid 6035HTC)
Registration and Tooling: XACTPCB Ltd. (XACT X-section)

Past Winners 

2010

Automation Tools: Production Solutions Inc. (RED-E-SET Ultra HD)
Cleaning Equipment: Aqueous (Trident Quad)
Cleaning Materials: Kyzen Corp. (Aquanox A4703)
Component Placement-High-Speed: Assembléon (MC-24X)
Component Placement-Multi-Function: Europlacer (XPii-II SMT Assembler)
Device Programming: Data I/O (FlashCORE III)
Labeling Equipment: Polyonics (XF-781 Thermal Transfer Printable Polyimide)
Materials-Flux: FCT Assembly (NC160 Flux)
Process Control Tools: KIC (e-Clipse Thermocouple Attachment)
Rework/Repair Tools: R&D Technical Services (Vaporworks 24 Rev 2)
Screen/Stencil Printing: DEK International (VectorGuard Platinum Dual Layer Stencil)
Software-Production: Panasonic Factory Solutions Co of America (PanaCIM Enterprise Edition)
Software-Process Control: Microscan (TTC Solution)
Software-Management: Valor (MSS)
Soldering-Materials: Cobar Solder Products (Aquasol)
Soldering-Reflow: Speedline Technologies (OmniMax Reflow Soldering System)
Soldering-Selective: Juki Corp. (Inline Flex Solder W510)
Soldering-Wave: SEHO Systems (SEHO Real-Time Fluxer Control)
Soldering-Other: EVS International (EVS 9000 Solder Dross Recovery Solution)
Test & Inspection-ICT: Acculogic Inc. (FLS980Dxi Flying Scorpion)
Test & Inspection-AOI: Koh Young (Zenith 3D AOI System)
Adhesives: Henkel Corporation (Hysol Eccobond CA3556HF)
Laminates: Rogers Corporation (RO4360 Thermoset)
Imaging: WKK Distribution Ltd. (X-Pose SM120 Exposure System)
System Modeling and Simulation Tools: National Instruments (NI Multisim 11.0 Circuit Simulation & Analysis Software)
PCB Design Tools: Sunstone Circuits (PCB123)2009

2009

Automation Tools: ASYS (FIFO Buffer System FPS30B)
Cleaning Equipment:  Speedline Technologies (Electrovert’s Aquastorm 100)
Cleaning Materials: Kyzen Corporation (Aquanox A4241)
Component Placement - High-Speed: Juki Corp. (FX3)
Component Placement - Multi-Function: Juki Corp. (JX100)
Device Programming: BPM Microsystems (Flashstream –C)
Dispensing Equipment: Asymtek (DispenseJet DJ-100)
Labeling: Polyonics (Product Sentry)
Materials-Flux: Nihon Superior (NS-F850)
Process Control Tools: KIC (RPI)
Rework/Repair Tools: VJ Electronix (400ST)
Screen/Stencil Printing: Milara (TD2929 Automatic Inline Printer)
Screen/Stencil Printing: Assembléon (Yamaha YGP)
Software-Production: Juki Corp. (Intelligent Shopfloor Solutions)
Soldering-Materials: Henkel Corporation (Multicore LF700)
Soldering-Reflow: Heller Industries (Mark 3.5 Series)
Soldering-Selective: Juki Corp. (Flex Solder Series)
Soldering-Other: EVS International (EVS 7000 Solder Dross Recovery)
Test & Inspection-AXI: Dage Precision Industries (Dage XD7600NT100)
Test & Inspection-ICT: Agilent Technologies (Cover Extend)
Test & Inspection-AOI: Mirtec Corp. (Mirtec MV-3L)
Underfills: Henkel Corporation (Hysol UF3800)
Soldering-Hand Tools: OK International (Metcal MX-5000 Series)

2008

Automation Tools:  Inovaxe (InoCart-MSD)
Cleaning Equipment:  Aqueous Technologies (Trident)
Cleaning Materials:  Kyzen (Aquanox A4625B)
Component Placement–High-Speed:  Siemens (SIPLACE X4i)
Component Placement–Multi-Function:  Europlacer (iineo)
Device Programming:  BPM Microsystems (Flashstream)
Dispensing Equipment:  Ovation Products (Stinger)
Labeling:  Polyonics (Polyimide Label Stock)
Materials-Flux:  Nihon Superior (NS-F850)
Process Control Tools:  ECD (Megam.o.l.e. 20 Thermal Profiler)
Rework/Repair:  R&D Technical Services (Vapor Works 24)
Screen/Stencil Printing:  ICON Technologies (ICON i8)
Software-Management:  Optimal (Optel)
Software-Process Control:  DEK (Instinctiv V9)
Software-Production:  Juki (OPASS)
Soldering-Materials:  Nihon Superior/Balver-Zinn/DKL/FCT (SN100C)
Soldering-Reflow:  Speedline Technologies (Electrovert IFC)
Soldering-Selective:  Juki (Juki 350)
Soldering-Other:  EVS International (EVS 1000 Solder Recovery System)
Test & Inspection–AXI:  VJ Electronix (Vertex Series "A")
Test & Inspection–ICT:  Everett Charles Technologies (Gemini Spring Pin)
Test & Inspection–AOI:  Mirtec (MV-7L)
Underfills:  Henkel (Loctite 3508)