| SJ Inno Tech Releases HP-520SPI 3D SPI |
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HP-520SPI is closed-loop solder paste inspection system that provides real-time measurement and control of solder paste. Automatically adjusts squeegee pressure and speed, initiates screen cleaning sequence, and stops production if a PCB cannot be brought into programmed specification. Three-stage automatic conveyor buffers printed circuit boards on entrance and exit. Features edge clamping; programmable control of squeegee pressure during print stroke; servo-controlled support table. SJ Inno Tech, www.sjinnotech.com
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Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...
