Ablestik WBC-8901UV is for stacked die packages for the memory market, including TSOPs, MCPs and FMCs. Reportedly reduces total cost of ownership up to 50% compared to film. Can adjust die attach thickness based on specific manufacturing requirements; can select dicing tape of choice. Is applied via a spray coating method following wafer thinning process. Dicing tape is laminated to the wafer; backgrinding tape is removed, and the wafer is diced in preparation for die pickup and placement. Wafer coating of 10 µm, with a total thickness variation across the wafer of +/-10%, and material waste of less than 20% are possible.

Henkel, www.henkelna.com