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# Article Title Date Author
4811 Genesis Comes to End; Kimball to Close Site Tuesday, 09 September 2008 Mike Buetow
4812 Compal Lowers 2008 Outlook, Reiterates 2009 Uptick Monday, 08 September 2008 Mike Buetow
4813 Abrams: RoHS Education, Not Enforcement, IPC’s Priority Friday, 05 September 2008
4814 Elcoteq Acquires Philips' Flat Panel TV Ops in Mexico Friday, 05 September 2008 Mike Buetow
4815 New Spec Covers Moisture Sensitivity of Passives, Connectors Friday, 05 September 2008 Mike Buetow
4816 Free Sept. 23 ECAD-MCAD Webinar Announced Thursday, 04 September 2008
4817 Automotive MEMS Sensor Market to Nearly Double by 2012 Thursday, 04 September 2008
4818 Asia-Pacific Semi Revenue to Grow 6.4% in 2008 Thursday, 04 September 2008
4819 Catalyst Starts Up 2d Tijuana Plant Thursday, 04 September 2008 Mike Buetow
4820 Kimball Buys Neighboring EMS Firm Genesis Thursday, 04 September 2008 Mike Buetow
 
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Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Yincae Rolls Out ACP120 Solderable Coating
ACP 120 series anti-oxidation solderable coatings replace nanofilm gold. Are for anti-corrosion and anti-rusting on solderable surfaces on which solder paste, solder preform or a solder ball can be...