ITC OKs Import of Tungsten Metalization ICs Print E-mail
User Rating: / 0
PoorBest 
Written by Mike Buetow   
Wednesday, 24 March 2010 07:24
WASHINGTON – The US International Trade Commission has reversed a lower court’s ruling, determining instead that several semiconductor firms are violating no patents on ICs using tungsten metalization.

In its ruling, the ITC terminated the investigation, which had been ongoing since May 2008.

In the original complaint, LSI and Agere Systems alleged violations of section 337 of the Tariff Act of 1930, covering the import and sale of ICs using tungsten metallization. The plaintiffs alleged infringement by several companies.

Prior rulings had eliminated certain parties from the complaint, leaving Tower Semiconductor, Jazz Semiconductor, Powerchip, Grace Semiconductor, Integrated Device Technology and Nanya as defendants.


blog comments powered by Disqus
Last Updated on Wednesday, 24 March 2010 07:50
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

Read more...
 
Bridging at Reflow

What causes it, and can it be eliminated?

Read more...
 

Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

Read more...
 
The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...