| Heraeus Acquires Lord Thick Film Cerment Product Line |
|
|
| Written by Chelsey Drysdale | |||
| Friday, 15 January 2010 09:16 | |||
|
CONSHOHOCKEN, PA – Heraeus Materials Technology has acquired Lord Corp.’s thick film cermet product line.
No financial terms were disclosed for the acquisition, which was completed Dec. 31. Lord’s cermet thick film technology, products, and customers were transferred from Elverson, PA, to the W. C. Heraeus Thick Film Materials Division in Conshohocken, PA. Lord will retain its polymeric thick film product line. Lord entered the market in 2002 when it acquired Metech.
|
Columns
| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
| Can Cook Take the Heat? |
CEO Tim Cook has taken to the Apple airwaves, rebutting claims made by The New York Times and others that company indirectly contributes to worker abuse but not rejecting Foxconn as a supplier. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
Products
KIC 24/7 Wave uses embedded sensors in the wave solder machine to automatically measure thermal profiles for each and every processed PCB to the acceptable process window. Thermocouple installed in...


