| SMTAI Conference on Soldering and Reliability Issues Call for Papers |
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| Written by Mike Buetow | |||
| Friday, 15 January 2010 09:08 | |||
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MINNEAPOLIS – SMTA requests abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto.
Suggested topics to be covered include SnPb with Pb-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; package-on-package; advanced packaging; halogen-free laminates; high-density interconnects; thermal interface materials, and underfill. Submit 200-300 word abstracts to Melissa Serres at This e-mail address is being protected from spambots. You need JavaScript enabled to view it . Include a title, author name and contact information. Abstracts are due Jan. 29. Authors will be notified of acceptance by February. Technical papers are required and will be due April 9. Visit http://smta.org/education/education.cfm#toronto for more information.
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| Last Updated on Friday, 15 January 2010 09:09 |
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