Pegatron to Take Flight Print E-mail
User Rating: / 0
PoorBest 
Written by Mike Buetow   
Friday, 11 December 2009 09:39
TAIPEI -- Asustek Computer will spin off its contract manufacturing business unit, Pegatron Technology, by July, in a move that immediately creates a Tier II EMS company.

The spunoff operations will be managed by Pegatron Investment Holdings Co., with 25% of shares held by Asustek and the remaining 75% going to Asustek shareholders.

The estimated value of the business assigned to Pegatron Holdings will be NT92.9 trillion ($2.8 billion) and all shareholders of the company will in total receive 75% of the equity. Asustek will reduce its capitalization an anticipated 85% based on the value of the spinoff.

The spinoff date is expected to be on July 1, the company said in a statement.

In doing so, Asustek will follow the lead of its Taiwanese rival Acer, which spun off Wistron in 2000 and BenQ in 2001. Asustek itself was founded in 1990 by four former Acer engineers.

Earlier this week, Pegatron reported sales year-over-year through November had fallen 4% to NT$419.54 billion. That translates to about $1.3 billion in sales, or $1.41 billion on an annualized basis. That would place Pegatron approximately 11th worldwide, behind Plexus and ahead of SIIX of Japan, based on preliminary 2009 revenues.

Pegatron was created in 2007, when Asustek Computer spun off its PC ODM business into a wholly-owned subsidiary (at the same time, Asustek spun off its chassis molds unit into a subsidiary named Unihan Technology). At that time, Pegatron took over the ASRock (motherboards) and AMA (lighting) units and Asustek's plant in Juarez, Mexico. The impact on its stake in bare board maker BoardTek Electronics is unclear.


blog comments powered by Disqus
Last Updated on Friday, 11 December 2009 12:04
 

Columns

An Early Spring?

The second half of 2011 is behind us, literally and figuratively.

Read more...
 
‘An End-to-End Solution for Assembled HDI Rigid-Flex’

Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology.

MLFEX executive and PCD&F columnist Jay Desai spoke with editor-in-chief Mike Buetow about the new partnership.

Read more...
 

Features

SMT Stencils from a Production Perspective

Is the slew of new materials, coatings and processes truly unique, or just the same old hype?

Read more...
 
Implementing Good Test Coverage and Eliminating Escapes

Experimental data reveal a strong correlation between SPI and AXI.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Polyonics Provides Double-Coated Tapes
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...