| Fujiploy Releases Sarcon SPG-30A Thermal Interface Compound |
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| Written by Chelsey Drysdale | |||
| Wednesday, 25 November 2009 12:38 | |||
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Sarcon SPG-30A is a high-viscosity, thermal interface silicone compound designed to transfer heat from a board-level source to a heat sink or heat spreader. Offers a thermal conductivity of 3.2 W/m°K. Also a thermal management option for electronic devices that operate at higher frequencies. Exhibits near-zero compression force and conforms to all component shapes and sizes. Is for filling large gaps around circuit board solder points. Requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range between -40º and 150ºC. Is available in 30cc tubes, 330cc cartridges and 10L pails.
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