| Commerce Dept. to Weight Export Changes |
 |
 |
| Written by Mike Buetow | |||
| Monday, 23 November 2009 12:17 | |||
|
WASHINGTON -- A US Department of Commerce committee will meet in two weeks to discuss emerging technology and research activities, including those related to deemed exports.
The Emerging Technology Committee will discuss deemed export control methodology during its Dec. 9 meeting in Washington. The partially open meeting will be accessible via teleconference to 20 participants on a first come, first served basis. Requests to join the teleconference are due no later than Dec. 2. In addition, a limited number of seats will be available at the public session, but reservations are not accepted.
|
|||
| Last Updated on Tuesday, 24 November 2009 13:10 |
Columns
| What’s Driving Electronics Packaging and Assembly Trends? |
Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why. |
| Read more... |
| Bridging at Reflow |
What causes it, and can it be eliminated? |
| Read more... |
Features
| Current Trends in Conformal Coatings |
Custom formulations have become the norm. |
| Read more... |
| The Worldwide Industrial Electronics Assembly Markets Defined |
Test, clean energy and process control represent huge potential for EMS. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...
