| Ziptronix to License 3D IC Technology for Imaging Systems |
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| Written by Mike Buetow | |||
| Wednesday, 18 November 2009 10:15 | |||
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MORRISVILLE, NC -- Raytheon Vision Systems has reached a licensing agreement for the use of Ziptronix' patented 3-D integration technology in Raytheon's imaging systems. The technology, DBI (Direct Bond Interconnect), will be used in manufacturing Raytheon's focal plane arrays for air, space and terrestrial applications, the Ziptronix technology provides true 3-D integration of multilayer CMOS structures, enabling 100% pixel operability within the focal plane.
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