| Cookson Launches Alpha CVP 520 Solder Paste |
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| Written by Chelsey Drysdale | |||
| Wednesday, 01 July 2009 14:02 | |||
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Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield. Cookson Electronics, www.alpha.cooksonelectronics.com
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| Boundary scan’s low-cost and IC level access has pushed its use beyond traditional board test applications. |
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Features
| Design for Testability |
| Main considerations for incorporating test in a board design. |
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How the CAM engineer can make the difference. |
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Seica Debuts Flyscan Module
FlyScan module integrates boundary scan and flying probe, and comes on the Pilot/Aerial flying probe testers. Is said to ensure automatic generation of the test program in a single software...
FlyScan module integrates boundary scan and flying probe, and comes on the Pilot/Aerial flying probe testers. Is said to ensure automatic generation of the test program in a single software...
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