| Anti-Trust Claim Tossed in Foxconn-Molex Suit |
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| Written by Mike Buetow | |||
| Thursday, 12 February 2009 06:19 | |||
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CHICAGO -- A federal judge has tossed out the Sherman Act claims in a dispute between Hon Hai Precision Industry (Foxconn) and Molex Inc. over a patent licensing contract between the two companies for a connector used with audiovisual equipment, but has let the other claims stand.
Judge Harry D. Leinenweber of the U.S. District Court for the Northern District of Illinois ruled this week that Hon Hai had not alleged sufficient facts to state a plausible claim.
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| Last Updated on Friday, 13 February 2009 06:46 |
Columns
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The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
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