| Semi Industry CEOs Call on House to Fund Research |
|
|
| Wednesday, 04 June 2008 06:41 | |||
|
SAN JOSE, CA – The Semiconductor Industry Association released a letter signed by more than 70 business, higher education and scientific leaders, including 14 executives from the semiconductor industry, to Speaker of the House Nancy Pelosi (D-CA) and Minority Leader John Boehner (R-OH). The letter urges House leaders to support the Senate-passed funding levels for science and engineering research in the fiscal year 2008 supplemental appropriations bill currently under consideration. A similar letter was sent to Senate Majority Leader Harry Reid (D-NV) and Minority Leader Mitch McConnell (R-KY). “The FY 2008 Omnibus Appropriations Act came up woefully short of the funding commitments made by Congress and the Administration in the Democratic Innovation Agenda and the American Competitiveness Initiative,” says the letter. “Now is the time to invest in America’s competitive future and prevent further backsliding.” The Senate-passed version of the supplemental appropriations bill includes $300 million for agencies that sponsor basic science and engineering research at U.S. universities: $200 million for the National Science Foundation and $100 million for the Office of Science in the Department of Energy.
|
|||
| Last Updated on Wednesday, 04 June 2008 06:42 |
Columns
| What’s Driving Electronics Packaging and Assembly Trends? |
Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why. |
| Read more... |
| Bridging at Reflow |
What causes it, and can it be eliminated? |
| Read more... |
Features
| Current Trends in Conformal Coatings |
Custom formulations have become the norm. |
| Read more... |
| The Worldwide Industrial Electronics Assembly Markets Defined |
Test, clean energy and process control represent huge potential for EMS. |
| Read more... |
Products
Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...


