BEST to Host Rework Symposium PDF Print E-mail
Thursday, 22 May 2008 12:50
ROLLING MEADOWS, ILBEST Inc., in conjunction with the SMTA Illinois chapter, will host the 2008 PCB rework symposium at its Chicago-area facility on August 14.

Other technical presenters will include OK International and VJ Technologies.

The symposium will consist of leadless device rework: the methodologies for reworking QFNs, LCCs and other leadless devices; secrets of Pb-free rework: helpful, practical hints for reworking Pb-free PCBs, and noncontact solder removal for rework.

In addition, hands-on demonstrations will include BGA reballing techniques, BGA x-ray inspection, QFN rework, and Pb-free hand soldering tips.

Last Updated on Thursday, 22 May 2008 14:27
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...