| Call for Papers Issued for SMTA China Conferences |
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| Thursday, 24 April 2008 08:28 | |||
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EDINA, MN – SMTA has issued a call for papers for SMTA China South (Aug. 26-28) and SMTA China North (Nov. 10-11). These events will be held in conjunction with Nepcon South China and Bohai Electronics Week. Topics to be covered include 01005 and chip-scale-package assembly; 3D SiP; challenges of PCB fabrication technology and surface finish; component supply integrity; cost reduction initiative; advanced low I/O packaging; flex circuit assembly; market trends in assembly manufacture; manufacturing engineering; materials and process characterization; Pb-free processes and product reliability; package on package; process control excellence; production and supply chain management; RoHS compliance and materials; risk-free rework/repairing, and inspection and failure analysis. SMTA requests technical papers for the technology or vendor conferences. Papers are requested in both Chinese and English; Chinese presentations are recommended. The deadline for abstracts for China South is May 15, and for China North, July 10. Submit abstracts to
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| Last Updated on Thursday, 24 April 2008 08:31 |
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