| U.S. Senate to Debate Patent Reform Bill |
|
|
|
| Tuesday, 08 April 2008 04:57 | |||
|
WASHINGTON, DC – The U.S. Senate is expected to debate the patent reform bill as early as this week. This comes on the heels of a court decision to block new rules the U.S. Patent and Trademark Office proposed to deal with the surge of applications. Majority leader Sen. Harry Reid is expected to bring the Patent Reform Act to the Senate between now and the end of May. The Senate bill is in line with the House of Representatives bill that passed in the fall. Both bills aim to limit damages and excessive litigation, namely courts that are quick to set trial dates for patent suits. The legislation also requests the U.S. to move to a first-to-file policy. Many large electronics firms are on board, claiming to be barraged with patent infringement litigation. Individual inventors and pharmaceutical companies have rallied against the measure, saying it would weaken the system that protects their innovations. In its fiscal year 2007, the USPTO received more than 467,000 patent applications and ended the year with a backlog of 760,000 applications. In an effort to catch up, the office hired more than 2,400 new patent examiners in the past two years, say published reports.
|
|||
| Last Updated on Tuesday, 08 April 2008 04:57 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Products
Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...



