| PCB West 2008 Issues Call for Abstracts |
|
|
|
| Wednesday, 26 March 2008 10:05 | |||
|
SMYRNA, GA – UP Media Group Inc. seeks abstracts for PCB West 2008, which will be held Sept. 14-19 in Santa Clara, CA. PCB West annually provides attendees and vendors with a conference and exhibition focused on the design and manufacture of PCBs, high density interconnect and other advanced circuits. Printed Circuit Design & Fab and Circuits Assembly magazines are sponsoring the event. The five-day conference program focuses on PCB engineering, design and fabrication. The conference is comprised of a 3-Day Technical Conference and a Professional Development Certificate program of one-day and two-day courses. PCB West 2008 also includes a two-day exhibition of top industry vendors to be held on Sept. 16-17. Papers and presentations of the following durations are sought for the 3-Day Technical Conference: 30-minute paper sessions One-hour lectures, presentations or panel sessions Two-hour workshops or panel sessions Half-day (3.5 hour) seminars Papers and presentations of the following durations are sought for a Professional Development Certificate program of in-depth courses: One-day tutorials (7 hours of instruction) Two-day tutorials (14 hours of instruction) For consideration, please submit all abstracts by April 17 via the online form at: http://www.pcbwest.com/speakers/abstract.shtml or e-mail course titles, suggested course length, the target audience, short course abstract(s) and speaker bio(s) to Ronda Faries (
This e-mail address is being protected from spambots. You need JavaScript enabled to view it
)';
document.write( '' );
document.write( addy_text49589 );
document.write( '<\/a>' );
//-->
This e-mail address is being protected from spambots. You need JavaScript enabled to view it
. Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products. If selected for PCB West 2008, final papers and presentations will be due in May. Suggested paper and presentation topics include (but are not limited to): High speed, high frequency and signal integrity Component placement EMI/EMC analysis Thermal analysis Lead-free processes (especially how they affect design and fabrication) RF and microwave design Packaging design Mixed-signal design Area arrays FPGA design and implementation Embedded passives and active devices Flexible circuitry HDI design and technologies PCB design/layout basics Component library creation and management Design for manufacture, test and assembly Design (including analog, digital and power supplies PCB fabrication Soldering Surface finishes Industry forecasts Business and design/supply chain issues For more information visit www.pcbwest.com.
|
|||
| Last Updated on Wednesday, 26 March 2008 10:05 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Products
EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....



