PCB West 2008 Issues Call for Abstracts PDF Print E-mail
Wednesday, 26 March 2008 10:05
SMYRNA, GAUP Media Group Inc. seeks abstracts for PCB West 2008, which will be held Sept. 14-19 in Santa Clara, CA.

PCB West annually provides attendees and vendors with a conference and exhibition focused on the design and manufacture of PCBs, high density interconnect and other advanced circuits.
 
Printed Circuit Design & Fab and Circuits Assembly magazines are sponsoring the event.
 
The five-day conference program focuses on PCB engineering, design and fabrication. The conference is comprised of a 3-Day Technical Conference and a Professional Development Certificate program of one-day and two-day courses.
 
PCB West 2008 also includes a two-day exhibition of top industry vendors to be held on Sept. 16-17.

Papers and presentations of the following durations are sought for the 3-Day Technical Conference:
30-minute paper sessions
One-hour lectures, presentations or panel sessions
Two-hour workshops or panel sessions
Half-day (3.5 hour) seminars

Papers and presentations of the following durations are sought for a Professional Development Certificate program of in-depth courses:
One-day tutorials (7 hours of instruction)
Two-day tutorials (14 hours of instruction)

For consideration, please submit all abstracts by April 17 via the online form at: http://www.pcbwest.com/speakers/abstract.shtml or e-mail course titles, suggested course length, the target audience, short course abstract(s) and speaker bio(s) to Ronda Faries ( This e-mail address is being protected from spambots. You need JavaScript enabled to view it )'; document.write( '' ); document.write( addy_text65635 ); document.write( '<\/a>' ); //--> This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
 
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
 
If selected for PCB West 2008, final papers and presentations will be due in May.

Suggested paper and presentation topics include (but are not limited to):
High speed, high frequency and signal integrity
Component placement
EMI/EMC analysis
Thermal analysis
Lead-free processes (especially how they affect design and fabrication)
RF and microwave design
Packaging design
Mixed-signal design
Area arrays
FPGA design and implementation
Embedded passives and active devices
Flexible circuitry
HDI design and technologies
PCB design/layout basics
Component library creation and management
Design for manufacture, test and assembly
Design (including analog, digital and power supplies
PCB fabrication
Soldering
Surface finishes
Industry forecasts
Business and design/supply chain issues
 
Last Updated on Wednesday, 26 March 2008 10:05
 

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