| Stack/POP Assembly Workshop Announced |
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| Monday, 10 March 2008 06:02 | |||
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OXFORDSHIRE, UK – A workshop covering stack/package on package, aimed at the next generation of design and assembly engineers, will take place May 1 in Oxfordshire. Presented by SMART Group and IMAPS, the event is aimed at engineers; designers; production; quality and inspection engineers. The workshop is also for managers who would benefit from a better understanding of the coating process. For more information, visit www.smartgroup.org/pdf/popassembly.pdf. To book a tabletop exhibition space, visit www.smartgroup.org/pdf/TableTopSpace2004.pdf.
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| Last Updated on Monday, 10 March 2008 06:03 |
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MPM Momentum compact printer is 30% smaller overall than standard Momentum. Configurable for dual lane and back-to-back processing. Wet print accuracy reportedly 18µm @ 6ó, Cpk>2. Reportedly...
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