| Datacon and Ablestik to Share Lab Sites |
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| Wednesday, 05 March 2008 04:39 | |||
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RADFELD, AUSTRIA and RANCHO DOMINGUEZ, CA – Datacon, a supplier of advanced packaging equipment, and Ablestik, a supplier of adhesives and specialty materials for semiconductor packaging and microassembly applications, have entered a joint technology development and product evaluation agreement. The partnership aims to strengthen the respective companies’ processes for thin die, stacked die handling and other advanced epoxy processes. Demo and laboratory sites in Trevose, PA; Radfeld, Austria; Rancho Dominguez, CA; and Shanghai will be open to both companies and their customers.
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| Last Updated on Wednesday, 05 March 2008 04:40 |
Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
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Viscom Announces SI 7.46 AOI Software Release
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...
