BizEsp Launches Oxford Solders for PCB Assembly PDF Print E-mail
Wednesday, 27 February 2008 06:55
OXFORD, UK - BizEsp Limited has announced the launch of Oxford Solders for electronics assembly products.

The product line will reportedly be marketed toward Chinese and Indian manufacturers, and will include solder powders and pastes, fluxes and BGA spheres.

The company claims strict adhesion to environmental laws.

The company will reportedly provide local service, support and training to clients in China and India. Mauricia Wang, business manager for China, will head client service operations. Wang has stated that the company is concerned about the environment and resource and energy sustainability, and their impact on the global economy, particularly in China.

With this in mind, the company will reportedly offer products based on environmentally responsible European and American technologies, and offer these "green" products to China at prices that are locally competitive, along with claimed higher customer service standards than those currently offered in China.

The company will display its products at the Nepcon shows in Shanghai and Shenzhen.



Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.



Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.





CB Login



English French German Italian Portuguese Russian Spanish


Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...