| BizEsp Launches Oxford Solders for PCB Assembly |
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| Wednesday, 27 February 2008 06:55 | |||
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OXFORD, UK - BizEsp Limited has announced the launch of Oxford Solders for electronics assembly products. The product line will reportedly be marketed toward Chinese and Indian manufacturers, and will include solder powders and pastes, fluxes and BGA spheres. The company claims strict adhesion to environmental laws. The company will reportedly provide local service, support and training to clients in China and India. Mauricia Wang, business manager for China, will head client service operations. Wang has stated that the company is concerned about the environment and resource and energy sustainability, and their impact on the global economy, particularly in China. With this in mind, the company will reportedly offer products based on environmentally responsible European and American technologies, and offer these "green" products to China at prices that are locally competitive, along with claimed higher customer service standards than those currently offered in China. The company will display its products at the Nepcon shows in Shanghai and Shenzhen.
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Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...



