| Assembly Research Consortium to Meet on Process and Reliability Issues |
 |
 |
 |
| Friday, 22 February 2008 05:24 | |||
|
OWEGO, NY – The Advanced Research in Electronics Assembly Consortium will gather Feb. 27-28 to review this year’s research plan and to review results of recent investigations. Attendees from more than 30 companies and institutions are expected to attend the two-day workshop in Owego for an in-depth look at process and reliability-related research in electronics assembly. During the workshop, Unovis researchers will review their 2007 findings pertaining to the consortium’s research tracks. Progress reports will highlight development in the consortium’s lead-free studies. Reliability issues pertaining to surface finishes, underfilling and repair will also be discussed. Also, recent investigations on TSV stacking will be presented.
|
|||
| Last Updated on Friday, 22 February 2008 05:24 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
