Meptec Thermal Management Symposium Program Finalized PDF Print E-mail
Wednesday, 20 February 2008 05:07
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council has finalized the program for its 4th Annual Thermal Management symposium.
 
The one-day event will be held Feb. 28 in San Jose.
 
Verdant Electronics president Joe Fjelstad will keynote the symposium, reviewing innovative ways engineers have responded to thermal challenges over time. His presentation, Beating the Heat – Dealing with the Thermal Challenge: Past, Present and Future, will look at some new and prospective materials and methods being developed to address thermal challenges.
 
Sessions include Thermal Solutions for Tomorrow’s ICs; Using Fine Grain, Full Chip Thermal Analysis to Solve SOC Design Issues; Thin-Film Thermoelectric Cooling for 3D Packages; Returning to Processor Roots Resolves Thermal Issues; WW Package Characterization, STATS ChipPac; Metal Thermal Interface Materials for the Electronics Industry; High Performance Modules on Copper Substrates; Thermal Interface Materials for IC Cooling - Design Considerations and Trends; Telecommunications - Power Users are Power Hungry; Applied Thermal Technologies - Telecom Equipments: Hard Limiting Factors and Opportunities; Leveraging FPGA Features to Address Power Management Challenges; Thermal Measurement and Characterization of a Multi-die Opto-Coupler; Green Technology – Fighting Global and Local Warming; Thermal Management for Advanced Electric Powertrain; Thermal Management in Fuel Cells, and Thermal Management Considerations in the Design of Solar Concentrators.
 
To register, visit www.meptec.org.
Last Updated on Wednesday, 20 February 2008 05:08
 

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