| Are DNA-based Electronics Next? |
|
|
|
| Monday, 28 January 2008 05:20 | |||
|
NETANYA, ISRAEL –A host of international universities have teamed on a $3-million effort to develop DNA-based self-organizing molecular electronics. With support from the EU, Tel-Aviv University, Hebrew University of Jerusalem, Regensburg University, Madrid University and the Lausanne School of Technology share a goal to create a prototype electronic component based on a single DNA molecule, and achieve DNA-based nanodevices based on the group’s previous realization of nanowires. The project's cost is estimated at about $3 million and is scheduled to end in April 2009. "We expect to realize a device-wire with a controlled non-linear response, either bi-stability or negative differential resistance, at the end of the project," the researchers said, according to published reports. The DNA-based nanoelectronic devices would be about 1000 times smaller than existing electronics, the report said.
|
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Products
Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...



