| Last Call for SMTAI Abstracts |
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| Friday, 04 January 2008 10:22 | |||
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ORLANDO – The SMTA issued its final request for abstracts for SMTA International, taking place Aug. 17-21 in Orlando. The deadline for abstracts is Jan. 7. (Short extension available upon request.) Abstracts will be accepted by March 3, and manuscripts are due June 1. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Material should be original, unpublished and noncommercial. Papers are being solicited in the following categories: evolving technologies/hot topics; components; assembly; PCB technology; process control, and business. Participation includes discounted conference registration. $1,000 cash awards will be offered for the best of conference paper, best of proceedings paper, and best international paper. Submit abstracts at www.smta.org/smtai/call_for_papers.cfm.
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Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
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