| Semiconductor Roadmap Webcast Jan. 22 |
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| Friday, 04 January 2008 10:18 | |||
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OAK BROOK, IL – The SIA will sponsor a free Jan. 22 Webcast to discuss the latest revisions to the International Technology Roadmap for Semiconductors. Alan Allan, Intel external programs staff engineer and roadmap committee member, will explain the important changes and additions, including discussion of “More than Moore,” reasons for the changes, and roadmap interpretation. To register, visit www.semiconductor.net/webcasts.
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Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
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Polyonics Provides Double-Coated Tapes
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...
