| 'The Technologies that Failed' Chat Today |
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| Written by Mike Buetow | |||
| Thursday, 28 February 2013 12:38 | |||
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ATLANTA -- Consider all the process-related equipment and materials that were conceived but either were short-lived or never made it: The plastic stencil. Unmixed solder and flux. TAB bonding. The list goes on. UP Media Group has assembled a group of longtime engineers to reflect on the "technologies that didn't change the industry" in a one-of-a-kind hourlong moderated chat. Guest moderators include Jan Vardaman, Chrys Shea and Joe Fjelstad. The chat takes place Feb. 28, from 2 to 3 PM Eastern, 11 to 12 noon Pacific. Participation is free but registration is required. Questions or comments may be submitted in advance. Click here for details.
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| Last Updated on Thursday, 28 February 2013 12:43 |
Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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