CIRCUITS ASSEMBLY Announces 2013 NPI Award Winners PDF Print E-mail
Written by Mike Buetow   
Wednesday, 20 February 2013 10:41

SAN DIEGO – Count on Tools was the big winner at last night's the CIRCUITS ASSEMBLY 2013 New Product Introduction Awards for electronics assembly equipment, materials and software.

COT took home awards for the best new product in two categories, making it the only multiple winner of the 6th annual event.

The NPI Awards recognizes leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.

The winners are:

Process Control Tools: Microscan (Mini Hawk Xi)
Screen/Stencil Printing: Speedprint (SP710avi with Advanced Dispense Unit)
Screen/Stencil Printing Peripherals: Count On Tools (ezLOAD PCB Support System for Screen Printers)
Cleaning Equipment: Austin American Technology (NanoJet Aqueous Inline Cleaning System)
Device Programming: BPM Microsystems (2800ISP Semi-Automated In-System Device Programmer)
Dispensing Equipment: Nordson Asymtek (NexJet System)
Test & Inspection – AOI: Mirtec (MV-9 2D/3D In-Line AOI Series)
Test & Inspection – ICT: Acculogic (Ultimate Accuracy Package for Flying Scorpion)
Test & Inspection – Functional Test: Multitest (InStrip 3D)
Test & Inspection – AXI: VJ Electronix (Vertex II X-Ray Inspection System)   
Test & Inspection – SPI: Parmi (SPI HS70)
Soldering Materials: Nihon Superior (SN100C P604 D4 Solder Paste)
Automation Tools: Count On Tools (Stripfeeder .mod Series)0
Component Placement – Multifunction: Universal Instruments (FuzionXC2-37 Platform)   
Soldering – Reflow: Rehm Thermal Systems (Vision XP 934 Quad Lane Convection Reflow Oven)
Soldering – Selective: ACE Production Technologies (ACE KISS-205 Selective Soldering with In-Line Concurrent Processing)
Cleaning Materials: Kyzen (Aquanox A4639 Electronic Assembly Aqueous Solution)
Labeling Equipment: Cogiscan (Murata Magicstrap for PCB RFID Tracking Integrated with Cogiscan TTC Middleware)
Software – Process Control: Viscom (SPI-AOI Uplink)
Soldering – Other: EVS International (EVS 10K Solder Recovery Machine)
Coatings/Encapsulants: FCT Assembly (NanoCoat Multilayer System)
Rework & Repair Tools: Air Vac Engineering (PCBRM100)
Flux: AIM (NC277 Liquid Flux)
First Article Inspection: CGI Americas (Newly n=1 First Article Inspection System)

The awards were presented during a special ceremony during the IPC Apex trade show in San Diego.

“Each year there’s a few true, exciting innovations,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY. “The judges this year noted significant advancements in data collection and analysis and direct, real-time feedback across many equipment lines.”



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