| Viasystems Suffers Net Loss on Fire, Lower Demand |
|
|
|
| Written by Mike Buetow | |||
| Friday, 15 February 2013 11:05 | |||
|
ST. LOUIS -- Viasystems Group today reported fourth-quarter sales were up a tick on acquisitions but down 16.4% sequentially on a broad-based drop in demand. For the period ending Dec. 31, the printed circuit board fabricator and contract assembler reported net sales of $273.6 million, up 1.7% year-over-year. The net loss was $14.5 million versus a profit of $15 million last year. Not counting the May 2012 acquisition of DDi, net sales for the quarter declined 18% year-over-year. DDi's sales were worth approximately $64.5 million. Assembly segment sales were $36.8 million, down 22.3% from a year ago and 36.4% sequentially. Operating income dropped by half to $800,000. Assembly segment net sales decreased in the industrial and instrumentation, automotive, and computer and data communications end markets, but increased in the telecommunications end market. Printed circuit board sales were up 5.7% to $236.8 million and operating income fell $20 million to $2.3 million. Overall operating income was $1 million, including special charges of $7 million to $9 million of net costs related to manufacturing inefficiencies related to a previously Adjusted EBITDA was $29.1 million, down from $44.1 million in 2011. "As previously announced, our reported net sales of $273.6 million for the quarter were down sequentially and year-over-year due to seasonal decline in demand combined with the impact of the fire in our Guangzhou, China factory and an expected pull-back in demand for our wind energy products," said Viasystems CEO David M. Sindelar. "Each of our end markets was down, with the exception of our military and aerospace end market which was up slightly." Sindelar expects first quarter consolidated net sales to be "similar" to fourth quarter numbers on seasonality related to the Chinese new year holiday and production ramp at Viasystems' Guangzhou, China, facility. The wind energy that will impact all of 2013."
|
Columns
| Semblant Warms to New Fluoroolymer Conformal Coating |
|
Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
Products
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...



