SMTA Requests IWLPC Abstracts PDF Print E-mail
Written by Chelsey Drysdale   
Thursday, 17 January 2013 16:39

SAN JOSESMTA requests abstracts for the 10th Annual International Wafer-Level Packaging Conference.

 

The event will be held at the DoubleTree Airport Hotel here Nov. 4 – 7.

Suggested topics include wafer level chip scale packaging; flip chip bumping; fan-out and redistribution; wafer and device cleaning; WL-enabled devices; nanotechnology; quality, reliability, and COO; MEMS processes and materials; MEMS design tools or methods; nano-MEMS and bio-MEMS; MOEMS integration; lab-on-chip; MEMS integration and interconnects; RF/wireless, sensors, mixed technology, optoelectronics; 3D WLP; thru silicon vias; silicon interposers; IC packaging substrate; embedded die and passives; modeling and simulation tools and methods; FEOL vs BEOL; chip to chip optical connection, and stacking processes.

The deadline for abstracts is Mar. 29.

For more information, contact Patti Hvidhyld at This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...