Report: 2011-2017 Materials Market to Grow at a CAGR of 24% PDF Print E-mail
Written by Chelsey Drysdale   
Tuesday, 30 October 2012 15:14

LYON, FRANCE – Demand for so-called "mid-end" tools and related materials for wafer-level packaging is surging, thanks to the growth of 3D IC and wafer-level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer bumping.

“The material market will grow from approximately $590 million this year to over $2 billion by 2017, with a CAGR of 24%, driven mainly by the expansion of 2.5D interposers and 3D TSV and WLP platforms,” says Amandine Pizzagalli, technology and market analyst, advanced packaging, at Yole Développement, which just released a study on the sector.

Also, the equipment market reached approximately $870 million in 2011, with a CAGR of 28%, fueled by the 3D IC technology with TSV interconnects, representing one of the main emerging areas in the coming years. This area offers opportunities for new equipment modification and new materials development, says the firm. A slight decrease in 2012 is forecast, since manufacturers invested in equipment tools dedicated to the 3D TSV and WLP markets last year, and high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet.

The materials market is diversified and segmented into several materials suppliers. Specialist material suppliers are involved and specialized in one specific sector. However, the equipment market for 3D TSV and WLP applications is fragmented and diversified, says Yole.

The firm identifies three main groups of equipment suppliers coming from different business markets: large equipment suppliers coming from the semiconductor and front-end area that have expanded their business into the 3D TSV and WLP semiconductor business through acquisition of other companies; equipment suppliers coming from niche application wafer processing markets with a broad product portfolio, and specialist equipment suppliers that have developed knowledge and expertise in specific equipment lines.

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...