| Jedec to Standardize Non-Volatile Wireless Memory |
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| Written by Chelsey Drysdale | |||
| Thursday, 12 April 2012 13:13 | |||
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ARLINGTON, VA – A new Jedec subcommittee will develop standards for non-volatile wireless memory.
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Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
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Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...
