iNEMI Assembles Committee for Strain Guidance White Paper PDF Print E-mail
Written by Chelsey Drysdale   
Friday, 30 March 2012 17:21

HERNDON, VAiNEMI is forming a project team to develop a white paper based on the Appendices A and B that were removed from the IPC9704A standard that was revised last month. The standard encompasses the impact of Pb-free electronics and incorporates consistent strain gage placement/measurement techniques to monitor printed circuit board assembly flexure within a manufacturing environment.

New Pb-free content additions within the appendices are intended to form the basis of the white paper guidance document. Legacy SnPb guidance will be maintained in the white paper. The benefit of this approach is to ensure that new Pb-free strain limiting guidance can be more easily updated in a timely manner.

The white paper will encompass various Pb-free technologies and materials: SnAgCu based alloys, laminates, PCB thickness; provide manufacturing strain guidance for
Pb-free BGA only based on existing data collection; recommend further testing, if necessary, based on existing data collection, and provide recommendations to the IPC/JEDEC committee for further industry review and feedback. BGA strain guidance will apply to primary attach and rework manufacturing process operations.

A teleconference will be held Apr. 5. iNEMI membership is required to participate in the project.

For more information, visit http://www.inemi.org/node/2218.

Last Updated on Monday, 02 April 2012 11:07
 

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