BANNOCKBURN, IL – IPC has revised its Assembly and Joining Handbook, updating the age-old tome on of electronics assembly and soldering techniques.

IPC-AJ-820, Revision A includes equations for designers and techniques for tin whisker mitigation. A “tin pest” section explains how parts with high tin content break down to powder under certain conditions.

The information varies from the past version in its conversational style and tone, says IPC.

OEMs and research facilities such as NASA and Naval Surface Warfare Center Crane provided input, as did members from a range of suppliers throughout the assembly and joining fields.

IPC members may request a free single-user download by sending an e-mail to This e-mail address is being protected from spambots. You need JavaScript enabled to view it within 90 days of the document’s publication. For more information, visit www.ipc.org/820.