New Infographics Highlight Environmental Issues Print E-mail
User Rating: / 0
PoorBest 
Written by Mike Buetow   
Friday, 27 January 2012 10:20

AUSTIN, TX -- Venkel recently released two infographics that touch on the prevailing environmental compliance issues in the electronics industry.

“Conflict Minerals 3TG”, a Conflict Minerals infographic, provides a visual overview of the issue. Minerals mined in the Democratic Republic of the Congo, including tungsten, tantalum, tin and gold (often referred to collectively as “3TG”) are coming under scrutiny because of the conditions under which these substances are obtained. Venkel has released the infographic as an educational resource on this important issue.

“This is the second of several infographics pertaining to environmental issues that we intend on releasing as educational resources for interested parties," said Alex Rivera, environmental compliance manager for Venkel. "An infographic of the Conflict Minerals issue is of particular interest since it highlights human rights abuses and not merely issues of the environment. We wanted to do our part in raising awareness, especially among those in our industry, and are hopeful that it will be a helpful tool."

The infographic includes a brief definition of a conflict mineral, a map showing worldwide production of each mineral, the estimated amount of funds that are going to the armed conflict within the DRC and a list of major players involved in the trade of these minerals. Also included is a listing of several human rights groups that have more information on the subject.

Venkel, a supplier of surface mount components, also released an infographic on RoHS, outlining the history and impact of the directive. It includes a timeline that highlights certain milestones from the creation of RoHS to where it is headed in the near future, and facts and figures that illustrate the impact that RoHS has had in reducing 3 commonly used elements in the electronics industry.


blog comments powered by Disqus
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

Read more...
 
Bridging at Reflow

What causes it, and can it be eliminated?

Read more...
 

Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

Read more...
 
The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...