N. American Semi Fab B2B Plummets PDF Print E-mail
Written by Mike Buetow   
Monday, 24 October 2011 10:59

SAN JOSE – North America-based semiconductor equipment manufacturers reported a sharp drop in orders in September, continuing a summer-long decline.

The 90-day moving average orders in September fell to $984.8 million, said SEMI. The three-month average worldwide bookings fell 15.3% from the final August level of $1.16 billion, and was down 40.4% from September 2010.

The three-month average worldwide billings was down 9.8% sequentially and 18.4% year-over-year to $1.31 billion.

The book-to-bill ratio dropped five basis points from the revised August figure to 0.75. A book-to-bill of 0.75 means that $75 worth of orders were received for every $100 of product billed for the month. A ratio below 1.0 is considered an indicator of a near-term market decline.

Semiconductor equipment is considered a leading indicator for future IC and printed circuit board orders.

“Both billings and booking continue to decline with three-month average bookings almost  reaching a value last reported in late 2009,” said Stanley T. Myers, president and CEO of SEMI. “While device makers are investing in advanced technology, broader investments await stability in the overall economic outlook.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of US dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

April 2011

1,635.4

1,602.4

0.98

May 2011

1,669.2

1,623.0

0.97

June 2011

1,640.2

1,540.4

0.94

July 2011

1,521.2

1,298.2

0.85

Aug 2011 (final)

1,457.7

1,162.4

0.80

Sept 2011 (prelim)

1,314.4

984.8

0.75

Source: SEMI October 2011

 


blog comments powered by Disqus
 

Columns

Semblant Warms to New Fluoropolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

Read more...
 
ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.

Read more...
 

Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.

Read more...
 
Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Viscom Announces SI 7.46 AOI Software Release
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...