BOSTON -- The SMTA and IEEE will hold a joint meeting at Benchmark Electronics to reveal the latest results of multiple research studies investigating nano-solders and Pb-free electronics in high-rel products.

The Feb. 1 meeting will include a tour of Benchmark's product assurance and failure analysis laboratory. The snow date is Feb. 8.

Speaking at the meeting will be several University of Massachusetts Lowell researchers who are studying wetting behavior of solder nanowires and nanorods as alternative nano-solders. Also, the New England Lead-free Electronics Consortium will present results from Phase IV of its thermal cycling and vibration testing of Pb-free test vehicles. And EMC will present work on a nanotechnology component surface finish said to eliminate tin whiskers.

Finally, Benchmark will present "Conversion of a High Reliability Exempt Product to Lead-Free," a look at work conducted on a network communications product designed to have a 25 year life under operating temperatures of -5°C to +50°C and relative humidity up to 90%.

The meeting will be held at Benchmark's Nashua, NH, site. RSVP to Mike Sivigny at This e-mail address is being protected from spambots. You need JavaScript enabled to view it .