| Semiconductor Manufacturing and Test Equipment (North America) |
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| Written by SEMI | |||
| Tuesday, 19 July 2011 11:20 | |||
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Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not track billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders.
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| Last Updated on Monday, 22 April 2013 09:08 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
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Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
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Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
