| Zestron Promises New Technologies, Larger Presence in '09 |
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| Tuesday, 06 January 2009 11:59 | |||
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MANASSAS, VA – Zestron this year will introduce several first-of-its-kind product technologies and will expand its engineering teams in each of its three facilities worldwide, the company said today. “Zestron will pursue its investment in personnel and its organization in 2009 to be well situated when the global economy recovers,” said Dr. Harald Wack, vice president and CEO of Zestron America. In its most recent move, Zestron Europe in December moved into a 36,000 sq. ft. facility in Ingolstadt, Germany, said to house Europe’s largest technical and analytical center, at more than 10,000 sq. ft.
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| Last Updated on Tuesday, 06 January 2009 12:14 |
Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
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