| US Patent Office Rejects Tessera Claims Again |
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| Tuesday, 05 August 2008 11:44 | |||
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SAN JOSE – The US Patent and Trademark Office issued an office action confirming the rejections of all claims of a Tessera Technologies Inc. patent in ex parte reexamination. The patent office previously rejected these claims in an earlier action. The patent relates to semiconductor packaging technologies used in a variety of applications. The provider of miniaturization technologies is asserting the ‘326 patent in two investigations pending in the U.S. International Trade Commission against a number of companies. The first of those actions was completed July 18. The second action is scheduled for a 7-day hearing to begin on February 5.
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| Last Updated on Tuesday, 05 August 2008 11:46 |
Columns
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I have mentioned numerous times that the first purpose of RoHS is to help make recycling easier. So RoHS was developed to support WEEE. One would imagine that, in doing this, the EU was primarily concerned with recycling in the EU. |
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| 2001 vs. 2009: Why Semis Did Better This Time |
The Great Recession that began in the fourth quarter of 2008, at the height of the holiday spending season, had an enormous effect on world economies in 2009. The bursting of the bubble housing market in the US resulted in the meltdown of financial institutions around the world. |
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Fujiploy Offers Sarcon GR-Tac
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
