| Report: IC Packaging Topped $30B in 2007 |
 |
 |
| Tuesday, 13 May 2008 06:50 | |||
|
SAN JOSE, CA – The worldwide IC packaging market reached $30.5 billion in 2007, reports Electronic Trend Publications. Some 151 billion ICs were produced during the year. Modest growth should continue in 2008 and 2009, before accelerating in 2010, the firm says. ETP found contract-packaging companies assembled nearly 49 billion ICs last year, or one-third of all components – for a value of $12.1 billion. The firm estimates the worldwide semiconductor output will grow to 261 billion ICs in 2012, a value of $47 billion.
|
Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
| Read more... |
| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
Polyonics Provides Double-Coated Tapes
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...
