| Report: System-on-Chip Challenges IP Firms |
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| Friday, 28 March 2008 07:53 | |||
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BOSTON – A new report notes that the semiconductor design IP sector grew to $1.5 billion in revenue in 2007, up approximately 11% year-over-year, a slower growth than in previous years. Yet in a twist, the success of IP for RF and wireless applications has indirectly contributed to slower growth for the semiconductor design IP sector overall, says a new report. Research firm Strategy Analytics claims, “Getting even a fraction of the IP cores on offer by more than 90 firms to work together, especially in SoCs for wireless devices, is a difficult challenge, but one made easier if done under one roof.”
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Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
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