| Tin Whiskers Email Forum Open |
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| Written by Mike Buetow | |||
| Wednesday, 12 March 2008 08:22 | |||
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SAN JOSE – An email forum for discussing tin whisker issues and research has been created and is up and running. The forum, also known as a listserv, came from discussions among numerous engineers interested in mitigating potential risks to high reliability products. To subscribe to the list, sending an email to This e-mail address is being protected from spambots. You need JavaScript enabled to view it with “subscribe” in the subject field.
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| Last Updated on Wednesday, 12 March 2008 08:22 |
Columns
| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
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| Can Cook Take the Heat? |
CEO Tim Cook has taken to the Apple airwaves, rebutting claims made by The New York Times and others that company indirectly contributes to worker abuse but not rejecting Foxconn as a supplier. |
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Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
Products
KIC 24/7 Wave uses embedded sensors in the wave solder machine to automatically measure thermal profiles for each and every processed PCB to the acceptable process window. Thermocouple installed in...


