| RoHS Guidance Notes Re-issued |
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| Written by Robin Norvell | |||
| Thursday, 11 August 2005 08:05 | |||
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LONDON -- The U.K. government is awaiting formal notification of the adoption of the Commission Decision establishing the RoHS Directive's maximum concentration values. To keep industry stakeholders informed of the latest developments, the DTI (Department of Trade and Industry) has issued a revised version of the draft non-statutory guidance first published in July 2004. The document now reads: For the purposes of the RoHS Regulations, a maximum concentration value of up to 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, PBB and PBDE and of up to 0.01% by weight in homogenous materials for cadmium will be permitted in the manufacture of new EEE. The revised issue, dated August 2005, is here.
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| Last Updated on Monday, 15 August 2005 06:15 |
Columns
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Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
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| Can Cook Take the Heat? |
CEO Tim Cook has taken to the Apple airwaves, rebutting claims made by The New York Times and others that company indirectly contributes to worker abuse but not rejecting Foxconn as a supplier. |
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Features
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Experimental data reveal a strong correlation between SPI and AXI. |
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KIC 24/7 Wave uses embedded sensors in the wave solder machine to automatically measure thermal profiles for each and every processed PCB to the acceptable process window. Thermocouple installed in...
