December 2008 Issue Print E-mail
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Sunday, 30 November 2008 19:00
December 2008 CA digital edition

December 2008 cover

FEATURES

  • Cover Story
    The Plexus Rx
    The best-performing publicly held EMS company is not Jabil, Benchmark nor Flextronics, but a quiet Midwestern entity with a primarily North American footprint and “too many” engineers. Why Plexus is our 2008 EMS Company of the Year.
    By Mike Buetow

  • Retrospective
    In Memoriam
    Circuits Assembly recalls friends and industry colleagues who won’t see 2009.

  • Solder Joint Reliability
    HIP Defects in BGAs
    Solder joints afflicted with head-in-pillow lack strength, and the components may fail under minimal mechanical or thermal stress. HIP is now known to be caused by certain process variables, including the BGA ball alloy, reflow process type, reflow profile and solder paste chemistry. The role each of these variables plays, and certain mitigation techniques, are identified in this study.
    By Karl Seelig

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: Plexus has perfected the art of the workcell. (Photo courtesy of Plexus Corp.)


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Last Updated on Tuesday, 02 December 2008 06:57
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Polyonics Introduces Double Coated Bonding Tapes
Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...