October 2008 Issue Print E-mail
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Written by Administrator   
Tuesday, 30 September 2008 19:00
October 2008 cover

FEATURES

  • Medical Electronics Assembly
    ‘Checking Up’ on Medical Electronics
    Medical electronics assembly demands a different set of criteria than do commercial PCBs. The US FDA requires specific documentation, especially for verification of certain processes. Today’s medical electronics assembly also requires special testing, avoiding obsolete components and a detailed evaluation of a Pb-free product, as a looming EU RoHS Directive is expected to include medical electronics.
    By Zulki Khan

  • Cover Story
    Solder Ball Attachment Using Laser Soldering
    Reballing BGAs due to rework and conversion from RoHS-compliant solders to SnPb (or vice-versa) typically requires subjecting the component to additional reflow cycles beyond component manufacturer recommendations. Laser attachment or laser reballing in an oxygen-free bath eliminates two additional temperature excursions and provides improved component reliability by facilitating the use of standard assembly reflow temperatures without mixed alloys.
    By Joshua Muonio and Richard Stadem

  • Components
    Improving QFN Reliability
    The proper amount of solder is needed to ground the bottom of a QFN package and simultaneously create a toe fillet. Too much solder on the ground plane can cause parts to float; too little means insufficient grounding. This article focuses on the toe fillet and bottom connection, which create a kind of two-pronged connector, providing electrical continuity from both points.
    By Joseph G. Ameen and Gilson V. Geralde

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On the cover: A laser reballing process can cut two temperature excursions. (Photos courtesy General Dynamics)


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Last Updated on Friday, 31 October 2008 06:30
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Kolb Releases PS300 2HY Stencil Cleaner
PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact...