August 2007 Issue Print E-mail
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Tuesday, 31 July 2007 19:00

August 2007 cover

August 2007 CA TOC

FEATURES

  • Korea RoHS/ELV Analysis
    Electronics Recycling in Korea
    The next big electronics producer to “go green” is Korea, with a national law governing electronics waste coming into effect Jan. 1.
    Junsik Yoon and Michael Kirschner

  • Component Placement
    Fastening Hardware Using SMT
    Traditional hardware options for assembling PCBs have baggage: time-consuming, exacting, and potentially damaging. But new fasteners specifically for PCB mounting can be placed and reflowed using the conventional SMT processes.
    Brian G. Bentrim

  • Cover Story
    Pb-free PTH Rework on a Thick, Heavy Assembly
    A study by a major EMS company found a forced convection platform, in conjunction with a solder fountain, dramatically reduced copper dissolution observed on a thick, heavy circuit board as compared with rework performed completely on the solder fountain.
    Robert Farrell, Paul Bodmer, Bruce Tostevin, Richard Russo and Gregory Morose

FIRST PERSON

  • Caveat Lector
    ‘Engineering’ a new executive order.
    Mike Buetow

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Ad Index
Nepcon South China Product Preview
Assembly Insider

On the cover: Copper dissolution remedies for thick, heavy boards. (Photos courtesy Benchmark Electronics)


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Last Updated on Saturday, 13 October 2012 08:16
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Polyonics Introduces Double Coated Bonding Tapes
Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...