FEATURES

• Cover Story
  A Study of Copper Dissolution During Pb-Free PTH Rework Using a Thermally Massive Test Vehicle
  A smaller process window exists when using SAC for solder fountain rework due to high copper dissolution rates when compared to a conventional SnPb process. The first of a two-part study.
  Craig Hamilton, Matthew Kelly, and Polina Snugovsky, Ph.D.

• Packaging Advances
  ‘Chiplets’ Create Multi-Species MCMs
  A new, somewhat daring method for packaging devices under development involves etching a pit in the surface of a silicon wafer, then inserting a tiny patterned chip (“chiplet”), which is then interconnected to other chips.
  Keith Gurnett and Tom Adams

• X-Ray Inspection
  Defect-Detection Strategies
  More complex PCBs require better defect recognition than 2-D x-ray provides, but faster speeds than conventional 3-D.
  James Benson

• SEA 2007
  ‘If We’re Not Number One, We Have Work To Do’
  Circuits Assembly’s Service Excellence Awards winner Mack Technologies explains its approach to customer service.
  Chelsey Drysdale

FIRST PERSON

• Caveat Lector
  Military programs are under fire.
  Mike Buetow

MONEY MATTERS

• Global Sourcing
  Vertical makes a comeback.
  Mike Buetow

TECH TALK

• On the Forefront
  Getting embedded.
  E. Jan Vardaman

• Screen Printing
  Printing 0.3 mm CSPs.
  Clive Ashmore

• Better Manufacturing
  Integrating NPI into the routine.
  Peter Grundy

• Tech Tips
  Locating your shorts.
  American Competitiveness Institute

• Wave Soldering
  Impurities: Harmless or not?
  Gerjan Diepstraten and Gert Schouten

• Test and Inspection
  Get in touch with remote technologies.
  Stacy Kalisz Johnson

• Pb-Free Lessons Learned
  No history? No problem!
  Chrys Shea

• Materials World
  Cornerbonding CSPs.
  Dr. Renzhe Zhao

• Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: SAC alloy use has been tied to increased copper dissolution. (Photos courtesy IBM and Celestica)