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Written by Administrator
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Monday, 31 October 2005 19:00 |
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FEATURES
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IR Rework A Novel IR Rework System Lead-free raises the reworked board temperature – and increases risk of frying other parts. Dynamic temperature control and sensors help manage the heat. Mark Cannon
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Cover Story Mixed Technology Gets Selective Through-hole is still a fundamental processing step – most boards today mix SMT and PTH technology. Selective and fountain soldering can reduce skips and opens over traditional wave processes. Here's a primer. Scott Buttars
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Academic Research Program for Calculation of Flip-Chip Standoff Height A simple Visual Basic file easily calculates bump heights and predicts flip-chip standoff gaps. Joshua Ampofo, Richard LaBennett, S. Akwaboa and Dr. F. Ferguson
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Pb-Free Transition Switching to Pb-Free: Wave Soldering How to adjust conveyors, pots, preheaters and solder modules for Pb-free processes. Markus Walter
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AOI Zero-Defect IC Inspection What role does camera view play in catching potential defects? The advantages and disadvantages of inspections performed with orthogonal and inclined cameras. Peter Krippner
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Backend Processes 0.1 Cent RFID Chip Assembly? While the world argues over the "nickel tag," the pursuit is on for technologies that would slash manufacturing costs. Hugo Pristauz
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On the cover: Selective soldering is gaining momentum for PTH processing. (Photo courtesy Juki Automation Systems)
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Last Updated on Tuesday, 07 February 2012 09:47 |