June 2004 Issue Print E-mail
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Monday, 31 May 2004 19:00

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FEATURES

  • COVER ARTICLE
    Investigating Voids
    Does a connection exist between pad finish and voiding in lead-free assemblies?
    Keith Bryant

  • SERVICE EXCELLENCE AWARDS
    Service Wins the Game
    "The purpose of a business is to create a mutually beneficial relationship between itself and those that it serves. When it does that well, it will be around tomorrow to do it some more."
    Robin Norvell, Assistant Editor

  • FOCUS ON HDI/ADVANCED TECHNLOGY
    Flip Chip Underfill and Flux Residue with Lead Free
    This study presents data on the compatibility of 17 different flux systems with two underfill systems in a lead-free flip chip assembly process.
    Brian J. Toleno, Ph.D., and George Carson, Ph.D.

  • AOI in a High-Mix/Low-Volume Environment
    The cost savings when using AOI can pay for the system on one job under the right circumstances.
    Matthew Holzmann

EMS Supplement

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Industry News
NETgain
HDI/Advanced Technology
The Fine Pitch - Q&A with Roger Savage, President, Kester
Europe Watch
Assembly Insider
Ad Index
Classifieds
SEMICON West Product Preview

Cover illustration courtesy of Dage Precision Industries, Aylesbury, UK.


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Last Updated on Tuesday, 07 February 2012 09:49
 

Columns

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Bridging at Reflow

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Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

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The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

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