FEATURES

• COVER ARTICLE
  Investigating Voids
  Does a connection exist between pad finish and voiding in lead-free assemblies?
  Keith Bryant

• SERVICE EXCELLENCE AWARDS
  Service Wins the Game
  "The purpose of a business is to create a mutually beneficial relationship between itself and those that it serves. When it does that well, it will be around tomorrow to do it some more."
  Robin Norvell, Assistant Editor

• FOCUS ON HDI/ADVANCED TECHNLOGY
  Flip Chip Underfill and Flux Residue with Lead Free
  This study presents data on the compatibility of 17 different flux systems with two underfill systems in a lead-free flip chip assembly process.
  Brian J. Toleno, Ph.D., and George Carson, Ph.D.

• AOI in a High-Mix/Low-Volume Environment
  The cost savings when using AOI can pay for the system on one job under the right circumstances.
  Matthew Holzmann

EMS Supplement

• EMS INSIGHT
  Get Ahead of Environmental Compliance
  Redesigning to environmental requirements can provide financial benefits and competitive advantage.
  Pamela Gordon

• FOCUS ON BUSINESS
  After China, What's Next?
  Singaporean companies explore new frontiers in Vietnam.
  Susan Mucha

• A Strong Framework for Outsourcing
  Think ISO/TS 16949 is just for automotive applications? Think again.
  Jim Lanigan

PERSPECTIVES

• Editorial

• On the Forefront
  Phil Zarrow, Ron Daniels and Jim Hall

• Ask Les
  Les Hymes

• Problem Solved
  Peter Bollinger and Vince Cook

DEPARTMENTS

Industry News
NETgain
HDI/Advanced Technology
The Fine Pitch - Q&A with Roger Savage, President, Kester
Europe Watch
Assembly Insider
Ad Index
Classifieds
SEMICON West Product Preview

Cover illustration courtesy of Dage Precision Industries, Aylesbury, UK.